Rapid advances in semiconductor integration technologies, wide bandgap compound semiconductors such as GaN, high frequency materials and electronics, and the next generation wired and wireless communication systems allow us to deliver benefits to the society that have not been possible before, for example, 5G/6G, Internet of Things (IoT), and high-speed lower-power data centers. In parallel to this, the unique properties of electromagnetic waves enable the use of RF and Microwave technology as a platform for interdisciplinary research projects in tackling global challenges such as non-invasive physiological signal monitoring for rapid diagnosis.
This session not only focuses on RF and microwave circuits and system design for the next generation wireless and wired communications, but also aims to invite researchers from fundamental Science involved in interdisciplinary research projects who work with RF and microwave technology.
DR. KIM, Jin-sup (KEIT)
[ 09:30 - 09:50 ]
Title: Introduce of R&D investment strategy of Ministry of Trade, Industry and Energy of Korea
DR. PAUL, Tasker (Cardiff University)
[ 09:50 - 10:10 ]
Title: GaN device characterisation using RF waveform measurement and waveform engineering techniques
DR. KIM, Dongsu (Korea Electronics Technology Institute)
[ 10:10 - 10:30 ]
Title: Si-based Quasi-MMIC and Wafer-level Interposer-MMIC Technologies for GaN Power Amplifiers
DR. CHOI, Jung Han (Fraunhofer Heinrich-hertz Institute)
[ 10:30 - 10:50 ]
Title: Introduction to ultra high-speed flexible 3D packaging technology